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<title>How Self-Aligned CFET Technology Could Extend CMOS Scaling Beyond 10 Angstroms </title>
<link>https://newsroom.lamresearch.com/self-aligned-cfet-architecture-cmos-scaling</link>
<description>Lam’s Semiverse Solutions team used digital twin modeling to explore a self-aligned CFET architecture that could help extend CMOS scaling beyond 10 Å.</description>
<pubDate>Tue, 29 Sep 2026 13:00:00 -0400</pubDate>
<guid>https://newsroom.lamresearch.com/self-aligned-cfet-architecture-cmos-scaling</guid>
<enclosure url="https://newsroom.lamresearch.com/image/Sept-Semiverse-Solutions-300x300.jpg" type="image/jpeg" alt="3D rendering of a self-aligned complementary field-effect transistor with vertically stacked NMOS and PMOS devices." />
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<title>Lam’s New Logistics Hub Built for Velocity, Resilience, and AI-Era Growth </title>
<link>https://newsroom.lamresearch.com/silicon-valley-semiconductor-warehouse-built-for-velocity-resilience</link>
<description>Lam Research’s new Silicon Valley warehouse speeds semiconductor parts retrieval and strengthens U.S. supply chain resilience. </description>
<pubDate>Tue, 29 Sep 2026 08:00:00 -0400</pubDate>
<guid>https://newsroom.lamresearch.com/silicon-valley-semiconductor-warehouse-built-for-velocity-resilience</guid>
<enclosure url="https://newsroom.lamresearch.com/image/Atlantis-Opening-300x300.jpg" type="image/jpeg" alt="Four local dignitaries stand together at the ribbon-cutting ceremony for Lam Research’s new Livermore logistics hub. " />
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<title>Why Panel-Level Processing Could Transform Advanced Semiconductor Packaging (Semi 101) </title>
<link>https://newsroom.lamresearch.com/panel-level-processing-advanced-semiconductor-packaging-semi-101</link>
<description>AI is increasing demand for larger and more complex chip packages. Traditional wafer-based packaging faces scaling challenges for large-format designs. Panel-level processing may improve...</description>
<pubDate>Tue, 08 Sep 2026 07:38:00 -0400</pubDate>
<guid>https://newsroom.lamresearch.com/panel-level-processing-advanced-semiconductor-packaging-semi-101</guid>
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<title>Lam’s Oregon Lab Expansion Launches to Accelerate AI Chip Innovation</title>
<link>https://newsroom.lamresearch.com/lam-oregon-lab-expansion-accelerates-ai-chip-innovation</link>
<description>Lam Research broke ground on a new advanced R&amp;D lab in Tualatin, Oregon, expanding cleanroom capacity and strengthening its global lab network. </description>
<pubDate>Mon, 31 Aug 2026 13:21:00 -0400</pubDate>
<guid>https://newsroom.lamresearch.com/lam-oregon-lab-expansion-accelerates-ai-chip-innovation</guid>
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<title>Virtual Fabrication Meets Stress Physics: Solving GAA Channel Non-Uniformity</title>
<link>https://newsroom.lamresearch.com/virtual-fabrication-gaa-channel-non-uniformity</link>
<description>Lam Semiverse® Solutions engineers used SEMulator3D® stress modeling to show how channel thickness, fin width, and lateral etch can be optimized to reduce stress non-uniformity and improve gate-all-around nanosheet transistor performance.</description>
<pubDate>Tue, 25 Aug 2026 17:37:00 -0400</pubDate>
<guid>https://newsroom.lamresearch.com/virtual-fabrication-gaa-channel-non-uniformity</guid>
<enclosure url="https://newsroom.lamresearch.com/image/August-Semiverse-Solutions-2-300x300-2.jpg" type="image/jpeg" alt=" Illustration of stacked gate-all-around nanosheet transistor channels showing uneven current flow, with one channel carrying more current than the others." />
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