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Lam Research, ASML, and imec Advance High-NA EUV Patterning

Jul 14, 2026

Technology

Advanced Packaging for AI: Why It’s Critical to the Next Era of Semiconductor Innovation

Jul 9, 2026

Guest and host talking at a podcast studio

Building a Future in Semiconductors at Lam Research (Podcast)

Jul 2, 2026

Modeling of nTSV corner rounding and various overlay (OVL) dimensions

Optimizing the Nano-TSV-to-BPR Connection in Backside Power Networks

Jun 29, 2026

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Jul 8, 2026

Lam Research Corporation Announces June Quarter Financial Conference Call

Lam Research Corp. (NASDAQ: LRCX) today announced that the company will host its quarterly financial conference call and webcast on Wednesday, July 29, 2026, beginning at 2:00 p.m. Pacific...

May 21, 2026

Lam Research Corporation Declares Quarterly Dividend

Lam Research Corporation (Nasdaq: LRCX) today announced that its Board of Directors has approved a quarterly dividend of $0.26 per share of common stock. The dividend payment will be made on July...

May 20, 2026

Lam Research Establishes Panel-Level Packaging Center of Excellence in Salzburg, Austria

SALZBURG, Austria, May 20, 2026 — Lam Research Corp. (Nasdaq: LRCX) today announced the establishment of its Panel-Level Packaging Center of Excellence (CoE) in Salzburg, Austria, marking...

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