MyLam
Lam Research Ships 1,000th Post-CMP Clean System To Philips
February 14, 2001

Lam Research Ships 1,000th Post-CMP Clean System To Philips FREMONT, Calif., February 14, 2001 - Lam Research Corporation (Nasdaq: LRCX) today announced shipment of the 1,000th post-CMP (chemical mechanical planarization) clean system. The Lam Synergy Integra clean system, which is integrated with Lam's Teres® CMP system, was delivered to Philips Semiconductor (NYSE: PHG), headquartered in Eindhoven, The Netherlands. Placed in Philips' San Antonio, Texas facility, it will be used for post-CMP clean following direct-polish STI (shallow trench isolation).

 

In addition to direct-polish STI, Philips also uses the Lam Synergy for all other post-CMP production applications. Philips is using the advanced Synergy cleaning processes to manufacture ASIC devices for the wireless communications, networking and consumer products industries.

"The shipment of this Synergy Integra is an important milestone for Lam, confirming that Synergy Integra is the industry's de facto standard for integrated post-CMP clean. Philips uses Lam's cleaning systems for all of its post-CMP clean applications. Despite the fact that other cleaning options are now available, users of competing CMP systems continue to request the Synergy Integra for post-CMP clean," stated Kevin Crofton, Lam's CMP/Clean deputy general manager.

"We have purchased Lam Synergy systems to add capacity for direct STI and ILD post polish clean, while also enabling some advanced development in our clean technology below 0.25microns. This particular unit is installed on our Lam Teres' CMP system, which was brought in to improve our STI CMP process. The Lam cleaners have been and will continue to be our tools of record for post-CMP clean," commented Albert Liu, Philips' CMP Processing Manager. Dean Spaugh, of Philips' CMP Manufacturing Operations added, "For us, it is a proven, low-risk solution to integrated post-CMP clean."

All Synergy Integra post-CMP clean systems use Double-Sided Scrubbing and Chemical Mechanical Cleaning (CMCTM) technologies for single-step processing. The Synergy Integra has an open architecture to enable integration, not only with Lam's Teres, but also with multiple CMP suppliers.

This press release contains certain forward-looking statements, which are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. Such forward-looking statements include, without limitation, anticipated product shipments under existing orders, shipment schedules, the prospective demand for the company's products, the future acceptance, performance and competitiveness of the company's products, and the technical and market transition to new processes. Such statements are based on current expectations and are subject to risks, uncertainties, and changes in condition, significance, value and effect, including those discussed in documents filed with the Securities and Exchange Commission, including specifically the report on Form 10-K for the year ended June 25, 2000, and the Form 10-Q for the quarter ended December 24, 2000. The company undertakes no obligation to update the information in this Press Release.

Lam Research Corporation is a leading supplier of front-end wafer processing equipment and services to the worldwide semiconductor manufacturing industry. The company’s common stock trades on the Nasdaq National Market under the symbol LRCX. Lam’s World Wide Web address is http://www.lamrc.com.

circle-arrow2circle-arrow2facebookgooglehandshake2health2linkedinmenupdfplant2searchtwitteryoutube