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- |Sep 6, 2024|
Lam pledged $10 million to FIRST® Global, a nonprofit inspiring future STEM leaders Our university programs help students explore what’s possible in their careers Alexandre Toscano has a...
- |Sep 4, 2024|
Sometimes the technology behind the scenes is just as impressive as the one that gets all the attention. So, it is with Generative AI. While most everyone seems to be falling over themselves...
- |Aug 28, 2024|
CheePing Lee explains how Lam Research is at the forefront of pioneering solutions like high-bandwidth memory (HBM) and hybrid bonding
- |Aug 27, 2024|
Digital twins help increase precision, affordability, sustainability, and speed-to-solution. Semiverse Solutions helps find the best process flow or recipe out of infinite combinations.
- |Aug 21, 2024|
The field of TCAD, once a humble tool in the vast landscape of semiconductor technology, has unveiled its invaluable riches
- |Aug 20, 2024|
Lam’s Equipment Intelligence® was recognized as the 2024 Innovative Product of the Year in the AI/Machine Learning category at the Sensors Awards
- |Aug 15, 2024|
Learn about three key semiconductor markets and Lam’s role in supporting our customers Find out what innovative technology is driving each market and Lam’s tools that help enable it Lam...
- |Aug 14, 2024|
To harness full potential of AI, we must contend with several grand challenges to enable 1,000-layer scaling.
- |Aug 8, 2024|
“Scaling to 1000-Layer 3D NAND in the AI Era" is a pivotal white paper written by Counterpoint Research and sponsored by Lam Research.
- |Aug 7, 2024|
Discover how Lam Research is achieving unprecedented storage capacities and speeds with their 1,000-layer 3D NAND chips.