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A joint paper from Lam Research, ASML, and imec puts 20 nm metal pitch in focus

AI is redefining semiconductor scaling Audrey Charles discusses the technologies, partnerships, and innovations that will define the future of semiconductor scaling AI is driving unprecedented...

A Lam scanning electron microscope technician shares how he started a career at Lam Research and continues his journey today as a lab supervisor.

SEMulator3D virtual fabrication optimizes backside power networks by modeling nTSV-to-BPR connectivity.

Panel-level packaging enables higher area efficiency and scalability for large-format advanced packages

See how Lam’s dry resist technology helps enable the precision, flexibility, and efficiency needed for next-generation EUV chipmaking.

As AI accelerates demand for advanced chips, sustainability is becoming essential for long-term growth

Driving the news: Lam Research moved up the Fortune 500, reflecting strong revenue in Lam’s most recent fiscal year as demand for advanced semiconductor accelerates in the AI era. Lam ranked 238...

Digital twin technology combined with machine learning enables a dramatic yield improvement from 1.6% to 87.2% in GAA logic manufacturing by simulating and optimizing the entire fabrication process.

The 2026 Lam Capital Venture Competition highlighted breakthrough semiconductor innovations with Lightfinder winning for its chip-scale optical sensing technology designed to enable real-time, in-tool metrology. This event showcased Lam Research's leadership in supporting startups that build the AI backbone for semiconductor manufacturing.