View PDFIn today’s semiconductor processing environment, mean time between cleans is a major limiter of etch system productivity. Etch process modules are typically cleaned monthly – or sometimes weekly – to maintain stable performance and replace parts eroded by plasma processing. In
“This groundbreaking achievement demonstrates Lam’s dedication to working collaboratively with customers to help solve some of their most challenging technology and productivity issues,” said
Etch process modules require maintenance and replacement of consumable parts, which can be both time and labor intensive because the chamber has to be opened, the part replaced, cleaned, and then the chamber needs to be requalified. This affects output and requires complicated scheduling. With self-maintaining solutions, the equipment knows when the part has to be replaced and will replace it autonomously without opening the chamber. This reduces tool downtime and enhances overall fab productivity.
This innovative solution includes Lam’s Kiyo® process module, Corvus® R replaceable edge ring with vacuum transfer, long-life chamber components, and optimized waferless autoclean technology. The key enabler of this unparalleled productivity is the Corvus R system, the industry’s first automated consumable part replacement system. Erosion of edge rings has long been a fundamental challenge in etch processing, requiring frequent chamber opens to replace parts. Corvus R automatically exchanges used edge rings with new edge rings without requiring the chamber to be opened.
This technology is part of Lam’s Equipment Intelligence™ suite of solutions, which integrates key elements to create self-aware, self-maintained, and adaptive tools and processes. The utilization of Equipment Intelligence solutions holds the promise of improved productivity, increased performance, and accelerated innovation through the integration of machine learning, artificial intelligence initiatives, and automated self-aware hardware and processes.
About
Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. As a trusted, collaborative partner to the world’s leading semiconductor companies, we combine superior systems engineering capability, technology leadership, and unwavering commitment to customer success to accelerate innovation through enhanced device performance. In fact, today, nearly every advanced chip is built with Lam technology.
Caution Regarding Forward-Looking Statements:
Statements made in this press release that are not of historical fact are forward-looking statements and are subject to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate to, but are not limited to, etch process module clean frequencies; our ability to achieve, the impact of and commitment to Industry 4.0 technologies; the impact of self-maintaining equipment; self-maintaining solutions and their impact; equipment intelligence solutions; our engineering capabilities; our technology leadership; our commitment to customer success; and our continued ability to accelerate innovation and enhance device performance. These forward-looking statements are based on current expectations and are subject to uncertainties and changes in condition, significance, value and effect, our continued financial health and ability to pay dividends, and other risks detailed in documents filed by us with the
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Source: Lam Research Corporation