- Lam solutions for large 300-mm wafers aid in MEMS evolution
- MEMS sensors are crucial in AI-powered devices and IoT applications
Lam’s Specialty Technologies capabilities provide solutions that help MEMS (micro-electro-mechanical systems) device manufacturers innovate as they transition from 200- to 300-mm wafers.
Beyond cost and efficiency improvements, advanced solutions from Lam can lead to improved on-wafer device performance across many fields, such as automotive tech, consumer electronics, and medical devices.
MEMS Characteristics
MEMS are made up of tiny mechanical and electrical parts created using advanced semiconductor processing techniques. A MEMS device can sense almost any change in the surrounding environment being monitored, either physical or chemical, by using small sensors, actuators, and other structures that in most cases are all built on a single silicon substrate.
MEMS devices play an important role in the future of advanced technologies for several reasons:
- Miniaturization: They can be microscopic, allowing their use in compact and portable devices.
- Integration: They combine electrical and mechanical elements into a single unit.
- Versatility: They are used in a wide range of applications, from car airbag sensors to medical glucose monitors to micro-lenses in cameras and other imaging systems, as well as RF filters for 5G, high-end MEMS microphones and micro speakers for advanced audio and communication.
300-mm Benefits
Lam Specialty Technologies enabled 200-mm wafer transition for MEMS devices in 2006 and we are currently on our 7th generation of products serving this market. The next generation of devices being built on 300-mm wafers have many potential benefits, including:
- Access to advanced process tools
- Enhanced on wafer device performance as a result of exceptional control over the across wafer uniformity, known as U% tunability
- Deployment of advanced equipment intelligence (AEI) delivering better within wafer and wafer-to-wafer repeatability
- Deployment of Lam’s suite of Equipment Intelligence® Services
3D Solutions
Further, Lam can help device manufacturers accelerate the development of processes on 300-mm MEMS wafers through virtual experimentation. In addition to iterating on physical tools, Lam engineers can transform the development process by using computational representations of the surface of a wafer and 3D simulations of device structures.
One approach we’ve taken is using our SEMulator3D® model to develop complementary metal-oxide-semiconductor (CMOS) image sensor processes, enabling engineers to run experiments quicker and iterate faster, from anywhere worldwide. Additionally, with fewer experiments to optimize the process, we were able to reduce costs and environmental impacts.
Next-Gen MEMS
An exciting addition to the Lam portfolio of products is Prestis™ – Lam’s pulsed laser deposition system that lets our customers explore new piezoelectric materials that enable enhanced device performance. To date Prestis technology has demonstrated better RF filter, microphone, and micro speaker performance compared to the existing methods of device manufacture.
AI Future
MEMS sensors are crucial in enabling AI-powered devices and IoT applications, providing the necessary data for intelligent decision-making and automation. MEMS devices built on 300-mm wafers will continue to find new applications, enabling even more compact and portable devices.
The path to 300-mm MEMS represents an inflection point in the industry. Their increased yield, enhanced performance, smaller feature sizes, and cost reductions make MEMS technologies more accessible. In Specialty Technologies, we will continue to work with our customers and research partners to deliver solutions to meet the evolving needs of the MEMS market.
Michelle Bourke is Managing Director of Strategic Marketing, Specialty Technologies
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