- AI is increasing demand for larger and more complex chip packages.
- Traditional wafer-based packaging faces scaling challenges for large-format designs.
- Panel-level processing may improve manufacturing efficiency and substrate utilization.
- The semiconductor industry is actively developing panel-level manufacturing solutions.
- Lam is helping advance the technology through precision process innovations.
As artificial intelligence drives demand for larger, more powerful semiconductor devices, advanced packaging has become a critical area of innovation. To address the growing size and complexity of AI chip packages, the industry is exploring panel-level processing, an emerging manufacturing approach that could improve efficiency, scalability, and cost effectiveness compared to traditional wafer-based methods.
What Is Panel-Level Processing in Semiconductor Engineering?
Panel-level processing is an advanced semiconductor packaging approach that uses rectangular panels instead of traditional round wafers, enabling greater manufacturing area efficiency and potentially supporting larger, more complex chip packages.
Panel-Level Processing vs. Wafer-Level Packaging
Feature |
Wafer-Level Packaging |
Panel-Level Processing |
|
Substrate Shape |
Circular wafer |
Rectangular panel |
|
Manufacturing Area |
Limited by wafer diameter |
Larger usable area |
|
Ecosystem Maturity |
Mature |
Emerging |
|
Large Package Support |
More constrained |
Potentially greater flexibility |
|
AI Package Scaling |
Increasing pressure |
Designed to address scaling needs |
Why AI Is Driving Interest in Panel-Level Packaging
In this latest Semi 101 video, discover why panel-level packaging is emerging as a promising approach for scaling advanced packaging, improving manufacturing efficiency, and enabling the next generation of high-performance computing. You'll also learn how Lam is helping advance the technology with innovations designed to deliver wafer-level precision, uniformity, and scalability across a range of panel sizes and substrate materials.
Watch the video below or on YouTube to learn:
- Why AI is increasing the complexity and size of advanced packages
- The limitations of traditional wafer-level packaging for large-format packages
- How panel-level processing could improve area efficiency and scalability
- The role Lam is playing in accelerating the panel-level processing roadmap
FAQ
What is panel-level packaging in semiconductor manufacturing?
Panel-level packaging (PLP) is an advanced manufacturing approach that processes square or rectangular panels instead of round wafers, which improves area utilization and scalability for large advanced packages.
Why is panel-level processing important for AI chips?
AI workloads require larger dies and denser interconnects, which increasingly exceed wafer efficiency limits. Panels offer a more scalable path to high-volume manufacturing.
How does panel-level processing differ from wafer-level packaging?
The main difference is substrate format. Wafer-level packaging uses circular wafers, while panel-level processing uses rectangular panels that can provide greater usable manufacturing area.
What challenges does panel-level packaging introduce?
Key challenges include uniformity control, yield management, automation, throughput, and establishing industry-wide panel standards.
What role does Lam Research play in panel-level processing?
Lam is developing process technologies designed to deliver precision, uniformity, and scalability for advanced panel-level manufacturing. To that end, Lam is investing in tool innovation and infrastructure, including our Salzburg Panel Center of Excellence, to accelerate R&D, qualification, and high-volume manufacturing (HVM) readiness.