| Su | Mo | Tu | We | Th | Fr | Sa |
|---|---|---|---|---|---|---|
| Su | Mo | Tu | We | Th | Fr | Sa |
|---|---|---|---|---|---|---|
-
May 6, 2009
Dense ULK and Diffusion Barrier Stack Absorbs Order-of-Magnitude More UV Radiation Than Porous Interconnect Alternatives
-
Apr 22, 2009
FREMONT, Calif., April 22, 2009 -Lam Research Corporation (NASDAQ: LRCX) highlights for the March 2009 quarter were: Lam Research Corporation today announced financial results for the quarter ended March 29, 2009. Revenue for the period was $174.4 million, gross margin was $36.5 million and net
-
Apr 22, 2009
NOVELLUS SYSTEMS REPORTS FIRST QUARTER RESULTS SAN JOSE, Calif., April 22, 2009-Novellus Systems, Inc. (NASDAQ: NVLS) today reported operating results for its first quarter ended March 28, 2009. Net sales for the first quarter of 2009 were $98.9 million, down $89.5 million or 47.5 percent from
-
Apr 16, 2009
NOVELLUS' COOLFILL CVD PROCESS ADVANCES TUNGSTEN FILL FOR SUB-32nm HIGH ASPECT RATIO STRUCTURES San Jose, Calif. - April 16, 2009- As semiconductor devices scale to the 32nm technology node and beyond, shrinking contact and via dimensions make chemical vapor deposition (CVD) of tungsten more
-
Apr 14, 2009
FREMONT, Calif., Apr 14, 2009 (BUSINESS WIRE) -- Lam Research Corporation (NASDAQ:LRCX) announced the company will host its quarterly financial conference call and webcast on Wednesday, April 22, beginning at 2:00 p.m. Pacific Time. Webcast To access the webcast, visit the Investors section of
-
Apr 9, 2009
Unique Hardware and Process Chemistry Extend Cu Manufacturing Capability
-
Apr 8, 2009
SAN JOSE, Calif., April 8, 2009- Novellus Systems, Inc. (Nasdaq: NVLS), today announced that it will provide its financial results for the first quarter 2009 in a conference call to be held...
-
Apr 1, 2009
Low Risk Solution Enabled by Novellus Architecture
-
Mar 18, 2009
Technology Package Delivers 5 Percent Lower keffective Without Complex Material Changes
-
Mar 17, 2009
Three-way Collaboration Advances Copper Interconnect Technology
for 32 Nanometers and Beyond
