- The latest VizGlow® release offers greater accuracy in simulations
- This physics-driven approach and virtual twins help engineers optimize processes
VizGlow® 3.1, Lam’s latest release of its plasma-modeling software, brings significant advances in plasma simulations. It features enhanced capabilities for modeling processes with representative gas and surface chemistries and performance improvements to the multispecies flow solver.
Why it matters: VizGlow 3.1 is the latest version of the powerful software tool that more easily simulates new materials, chemistries, and operating models used during critical steps in the wafer development process, including etch, deposition, and cleaning. Engineers can now fine-tune reactor process steps more efficiently.
Zoom in: VizGlow uses a physics-driven plasma modeling approach to resolve technical problems and improve designs and process recipe conditions in semiconductor manufacturing equipment. The software's ability to help users predict the behavior of new designs and processes reduces the need for physical prototypes, saving valuable resources and time.
Key Benefits
- Smarter predictions: VizGlow 3.1 provides even greater accuracy in simulating low-pressure plasma discharges, a critical aspect of modern semiconductor manufacturing.
- Faster simulations: Simulation times are shorter, allowing engineers to explore a broader range of design options and optimize processes more efficiently.
- Environmentally friendly: Virtual simulations contribute to sustainability by decreasing the need for prototype development and have the potential to reduce material waste and greenhouse gas emissions.
Between the lines: This in-house software development strategy began with the acquisition of Esgee Technologies, an Austin, Texas-based developer of modeling and plasma simulation software.
Alex Guermouche is a product marketing and technical writer and Vivek Subramaniam is a senior product manager of Semiverse Solutions, Plasma Simulations.
Related Information
- OverViz Products
- Lam Research Revolutionizes Semiconductor Process Development with High-Fidelity Plasma Simulation
- How Are Digital Twins Used in the Semiconductor Industry?
Caution Regarding Forward-Looking Statements
Statements made in this article that are not of historical fact are forward-looking statements and are subject to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate to but are not limited to: market and industry trends; the potential applications, benefits and opportunities related to our products; the future growth of the semiconductor industry and demand for artificial intelligence products and process; and the potential sustainability benefits of our products. Some factors that may affect these forward-looking statements include: trade regulations, export controls, trade disputes, and other geopolitical tensions may inhibit our ability to sell our products; business, political and/or regulatory conditions in the consumer electronics industry, the semiconductor industry and the overall economy may deteriorate or change; the actions of our customers and competitors may be inconsistent with our expectations; supply chain cost increases and other inflationary pressures have impacted and may continue to impact our profitability; supply chain disruptions or manufacturing capacity constraints may limit our ability to manufacture and sell our products; and natural and human-caused disasters, disease outbreaks, war, terrorism, political or governmental unrest or instability, or other events beyond our control may impact our operations in affected areas; as well as the other risks and uncertainties that are described in the documents filed or furnished by us with the Securities and Exchange Commission, including specifically the Risk Factors described in our annual report on Form 10-K for the fiscal year ended June 30, 2024 and our quarterly report on Form 10-Q for the quarter ended September 29, 2024. These uncertainties and changes could materially affect the forward-looking statements and cause actual results to vary from expectations in a material way. The Company undertakes no obligation to update the information or statements made in this article.