Gearing Up for SEMICON China 2017
SEMICON China logo
Mar 6, 2017

In recent years, SEMICON China has become the semiconductor industry’s largest annual tradeshow, with much of its popularity likely due to the region’s growing chipmaking business. Attendees from around the world will gather at the Shanghai New International Expo Centre on March 14-16, 2017, for this year’s event. A number of the show’s activities will focus on building manufacturing infrastructure as China continues to grow as an important region for the semiconductor industry. Chinese companies are expected to be supplying about 60% of the world’s smartphones by 2020, according to SEMI’s January 2017 Global Update. At the same time, the region is relatively new to the semiconductor industry and is still developing process technologies. “Only 5% of China’s semiconductor capacity is for ≤ 28 nm manufacturing capability,” SEMI reported, so the show plays an important role in supporting the region’s chipmakers.


Kicking off the show, the Grand Opening event will feature keynote talks on the state of the industry, major trends, and other timely topics. We are honored that Lam’s President and CEO Martin Anstice will be joining other industry leaders who have been invited to share their perspectives at this important event. In addition, the show’s “China IC Industry” program includes several events focused on development of the region’s semiconductor business. Lam is co-sponsoring two of the forums and presenting talks at each.

Collaborating for Success
Martin Anstice (Lam Research)
Grand Opening Keynote
Tuesday, March 14, 2:00 PM

Critical Challenges and Solutions in 3D NAND Volume Manufacturing
Rich Wise (Lam Research)
China Memory Strategic Forum
Tuesday, March 14, 10:55 AM

Advanced Packaging Technology and Applications
Tom Bondur (Lam Research)
Build China’s IC Ecosystem Forum – Equipment and Material
Wednesday, March 15, 2:30 PM

Technical Symposia

Attendees also benefit from the SEMICON China’s close association with the China Semiconductor Technology International Conference (CSTIC), being held in conjuction with the show on March 12-13. Set to explore a wide range of manufacturing topics, CSTIC 2017 provides an excellent opportunity to learn about the industry’s latest advances in semiconductor technology. The conference will feature nine technical symposia organized around core areas such as lithography and patterning, as well as etch and clean. We are proud to be a Silver Sponsor of CSTIC, and several Lam experts will share new developments and enabling technologies for both logic and memory at advanced nodes.

(Keynote) Patterning Technology Inflections for the 10 nm and Beyond Logic Nodes
Rich Wise (Lam Research)
Symposium II: Lithography and Patterning/Symposium III: Dry and Wet Etch and Cleaning
Sunday, March 12, 2:05 PM

Effects of N-free DARC and NDC on Low-k Trench Plasma Etch
Jihong Zhang (Lam Research)
Symposium III: Dry and Wet Etch and Cleaning
Sunday, March 12, poster session

(Keynote) New Challenges and High-Productivity Solutions for Tungsten Metallization in Memory and Logic
Frank Huang (Lam Research)
Symposium IV: Thin Film, Plating and Process Integration
Monday, March 13, 1:55 PM

Complete schedules and registration information can be found on the SEMICON China website. We look forward to meeting with you at the show.

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