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Digital twin technology combined with machine learning enables a dramatic yield improvement from 1.6% to 87.2% in GAA logic manufacturing by simulating and optimizing the entire fabrication process.

The 2026 Lam Capital Venture Competition highlighted breakthrough semiconductor innovations with Lightfinder winning for its chip-scale optical sensing technology designed to enable real-time, in-tool metrology. This event showcased Lam Research's leadership in supporting startups that build the AI backbone for semiconductor manufacturing.

Equipment Intelligence® encompasses Lam’s technology portfolio both on and off tool to leverage sensors, data, algorithms, artificial intelligence, and robotics automation to make tools more autonomous and productive.

As semiconductor manufacturing grows more complex, sensor‑driven intelligence is emerging as a critical enabler of autonomous, data‑driven fabs.

Lam Research won two prestigious 2026 Edison Awards, for ALTUS® Halo and Akara®

Pattern-dependent etch can lead to variations across the same chip. Dummy fill and SEMulator3D® help reduce shallow trench isolation and recess nonuniformity.

In semiconductor manufacturing, precision is everything. As chips become more advanced and fabs operate under unprecedented pressure to meet AI-driven demand, even the smallest maintenance error...

Everything—NAND, Logic, DRAM, and packaging—is going 3D. The 3D era demands deeper etch and precise deposition to build taller, tighter devices.

In this edition of Semi 101, we explore the evolution of transistor architectures that have enabled logic scaling.

Lam’s leadership in 3D NAND built the playbook for memory’s complex architectural transition. Companies that learn from and apply their experience will lead the way to 3D DRAM.