SEMICON China to Showcase Semiconductor Industry
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Mar 4, 2016

The global semiconductor industry will be heading to the Shanghai New International Expo Centre for this year’s SEMICON China, which takes place March 15-17. Held in one of the largest and most influential regions in the semiconductor ecosystem, this annual tradeshow will showcase the challenges and opportunities in semiconductor, nano-scaled structures, micro-electromechanical systems (MEMS), and related technologies.

Lam President and CEO Martin Anstice will give one of the keynote presentations, joining other top global industry leaders at the grand opening of SEMICON China 2016. During the China Memory Strategic Forum, Vahid Vahedi, group vice president of Etch Products, will share his thoughts on this important developing area. In addition, Michelle Bourke from our Customer Support Business Group will speak at the Advance Technology session of the Build China IC Manufacturing Ecosystem Technology Forum.

Our technologists will also be on hand at the China Semiconductor Technology International Conference (CSTIC), held during the two days preceding the tradeshow. Lam is pleased to be a silver sponsor of this conference, which covers all aspects of semiconductor technology and manufacturing. A summary of our presentations throughout the event is provided below.


SEMICON China Presentations

Grand Opening Keynote
Martin Anstice
Tuesday, March 15, 4:05 PM

Technology Forum: China Memory Strategic Forum
Vahid Vahedi
Tuesday, March 15, 9:55 AM

Technology Forum: Build China IC Manufacturing Ecosystem
Michelle Bourke
Wednesday, March 16, 2:50 PM


CSTIC Presentations

(Invited) Patterning Technology Inflections for the 10 nm, 7 nm, and 5 nm Logic Nodes
Rich Wise
Symposium III: Dry & Wet Etch and Cleaning
Sunday, March 13, 3:50 PM

Panel Discussion: Main Challenges in FinFET Manufacture
Yang Pan
Sunday, March 13, 5:00 PM

Study of Surface Control During Barrier Layer Etch
Weijun Luo
Symposium III: Dry & Wet Etch and Cleaning
Sunday, March 13, poster session

Effects of Bias RF Pulsing Plasma in Implant Layer BARC Etch Process
Kui Wang
Symposium III: Dry & Wet Etch and Cleaning
Monday, March 14, 9:30 AM

(Invited) Application of Cobalt Electroplating for IC Interconnects
Natalia Doubina
Symposium IV: Thin Film and Process Integration
Monday, March 14, 2:20 PM


Complete schedules and registration information can be found on the SEMICON China website. We look forward to meeting with you at the show!