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Innovative Copper Seed Provides Bottom-up Fill That Reduces The Pre-Electroplating Aspect RatioJul 13, 2009
Innovative Copper Seed Provides Bottom-up Fill That Reduces The Pre-Electroplating Aspect Ratio
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Jul 13, 2009
NOVELLUS SYSTEMS REPORTS SECOND QUARTER RESULTS SAN JOSE, Calif., July 13, 2009-Novellus Systems, Inc. (NASDAQ: NVLS) today reported operating results for its second quarter ended June 27, 2009. Net sales for the second quarter of 2009 were $119.2 million, up $20.3 million or 20.5 percent from
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Jul 13, 2009
Leading Global Equipment Supplier to Locate Researchers and Cutting-Edge Tools at CNSE's Albany NanoTech to Support Development of Sub-22nm Chip Technologies
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Jun 29, 2009
NOVELLUS ANNOUNCES AVAILABILITY AND TIMING OF SECOND QUARTER 2009 EARNINGS AND ANALYST AND PRESS EVENT AT SEMICON WEST SAN JOSE, Calif., June 29, 2009 - Novellus Systems, Inc. (Nasdaq: NVLS), today announced that it will provide live webcasts of the following events on July 13, 2009: Second Quarter
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2009 Customer Satisfaction Survey Awards Novellus the Highest Ranking In Cost Of Ownership and Customer CommitmentJun 25, 2009
2009 Customer Satisfaction Survey Awards Novellus the Highest Ranking In Cost Of Ownership and Customer Commitment