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May 27, 2009
NOVELLUS' HCM® IONX™ XL Ta(N) BARRIER TECHNOLOGY ENABLES 3X/2Xnm MEMORY TRANSITION TO COPPER San Jose, Calif. - May 27, 2009 - Ten years after the introduction of copper metallization for logic device manufacturing, Physical Vapor Deposition (PVD) copper barrier-seed and copper
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May 26, 2009
NOVELLUS ANNOUNCES AVAILABILITY OF THE WEBCAST OF ITS PRESENTATION AT THE BANK OF AMERICA AND MERRILL LYNCH 2009 U.S. TECHNOLOGY CONFERENCE SAN JOSE, Calif., May 26, 2009- Novellus Systems, Inc. (Nasdaq: NVLS), today announced that the company will present on Thursday, June 4, 2009, at the Bank of
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May 26, 2009
FREMONT, Calif., May 26, 2009 (BUSINESS WIRE) -- Lam Research Corporation (NASDAQ:LRCX) today announced it will present at the Bank of America and Merrill Lynch U.S. Technology Conference on Wednesday, June 3 at 8:15 a.m. Pacific Time. A live webcast of the presentation will be available to the
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May 14, 2009
NOVELLUS ANNOUNCES AVAILABILITY AND TIMING OF MID-QUARTER UPDATE CONFERENCE CALL WEBCAST FOR SECOND QUARTER 2009 SAN JOSE, Calif., May 14, 2009- Novellus Systems, Inc. (Nasdaq: NVLS), today announced that it will provide its mid-quarter update for the second quarter 2009 in a conference call to be
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May 13, 2009
Innovative, CF4-Based Approach Eliminates Photoresist Popping and Residues That Negatively Impact Yield