Advanced Packaging Techniques (Semi 101)
Oct 30, 2025
|

The shift from traditional semiconductor packaging to advanced packaging techniques requires the integration of different types of chips into a single package. Advanced packaging is needed to drive performance improvements and create competitive advantages for semiconductor manufacturers.
Learn about advanced packaging techniques in this Semi 101 video and Lam's innovations that are enabling the precision, uniformity, and scalability required for this next generation in semiconductor manufacturing.
Related Articles
- What Is Advanced Packaging? (Semi 101)
- Etch Breakthrough Enables Advanced Packaging: Lam Researchers Innovate Heterogeneous Integration
- The AI Revolution Depends on Advanced Packaging