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|May 7, 2026|As semiconductor manufacturing grows more complex, sensor‑driven intelligence is emerging as a critical enabler of autonomous, data‑driven fabs.
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|Apr 27, 2026|Lam Research won two prestigious 2026 Edison Awards, for ALTUS® Halo and Akara®
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|Apr 8, 2026|In this edition of Semi 101, we explore the evolution of transistor architectures that have enabled logic scaling.
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|Mar 19, 2026|Integrity isn’t optional at Lam, and this latest recognition underscores that commitment.
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|Mar 17, 2026|IBM and Lam Research have partnered in a five-year collaboration to develop processes that enable logic chip scaling beyond the 1nm node using high-NA EUV lithography.
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|Mar 10, 2026|The 2026 Lam Capital Venture Competition is a unique event that connects semiconductor startups with industry leaders, investors, and technical experts to advance AI-enabled semiconductor technologies.
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|Feb 24, 2026|With AI's overwhelming demand for DRAM, Lam is accelerating its response with streamlined workflows and specialized tools help speed efficiency, yield, and cost savings.
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|Feb 19, 2026|As a viable alternative to silicon, gallium nitride (GaN) can help data centers meet the growing demands of AI by enabling more efficient power delivery and reducing energy consumption.
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|Feb 13, 2026|DRAM scaling has reached the angstrom level—and the advanced architectures and processes that make higher performance and lower cost per bit possible. Watch now to see how memory keeps getting smaller.
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|Feb 12, 2026|Lam Research and CEA-Leti have formed a multi-year partnership to accelerate the development of specialty technology devices critical for AI hardware. This collaboration focuses on advancing materials, processes, and manufacturable solutions to improve energy efficiency and performance in AI data centers.
