Focus on Next-Gen Chipmaking at SPIE Advanced Lithography Symposium
stock photo man speaking on stage
Feb 21, 2017

It really is remarkable how our favorite tech products continue to become more compact and powerful, with today’s nanoscale chipmaking quite literally pushing the limits of what is possible. One of the extraordinary capabilities behind this ongoing device scaling is continued advances in patterning – the set of processes involved in creating the individual features on a chip. Every year, the SPIE Advanced Lithography symposium brings together leaders across the semiconductor industry to discuss the latest challenges in lithography and patterning. Being held at the San Jose Marriott and San Jose Convention Center, February 26 – March 2, 2017, the week-long event will feature seven technical conferences covering recent developments and emerging strategies for topics such as advanced patterning, new materials, and processing control.

Lam is pleased to once again sponsor the Advanced Etch Technology for Nanopatterning conference, and we will be participating in several sessions during the symposium. You can hear about some of the latest advances in patterning solutions from Lam and our collaborators at the following presentations:

Plasma-Assisted Thermal Atomic Layer Etching of Al2O3
A. Fischer, R. Janek, J. Boniface, T.B. Lill, K.J. Kanarik, Y. Pan, V. Vahedi, R.A. Gottscho (Lam Research)
Advanced Etch Technology for Nanopatterning (Conference 10149)/
Advances in Patterning Materials and Processes (Conference 10146)
Tuesday, February 28, 2:00 PM

Reducing the Impact of Etch-Induced Pattern Asymmetry on Overlay by Using Combined Lithography and Etch Tool Corrections
M. Kubis, C. Chahine, K. Viatkina, M.V. Dusa (ASML); R.J. Wise, D. Hellin, D. Sobieski, W. Zhang, G.A. Dixit (Lam Research); C. Jehoul, P. Jaenen, P. Leray (imec)
Advanced Etch Technology for Nanopatterning (Conference 10148)/
Optical Microlithography (Conference 10147)
Wednesday, March 1, 8:50 AM

Directed Self-Assembly of 5 nm Block Copolymer Lamellae
A.P. Lane (U. of Texas at Austin); X.M. Yang (Seagate Technology); M.J. Maher (U. of Minnesota); G. Blachut, Y. Asano, Y. Someya, A. Mallavarapu (U. of Texas at Austin); S. Sirard (Lam Research); C.J. Ellison (U. of Minnesota); C.G. Willson (U. of Texas at Austin)
Advances in Patterning Materials and Processes (Conference 10146)
Wednesday, March 1, 2:10 PM

Integrated Approach to Improving Local CD Uniformity in EUV Patterning
A. Liang (Lam Research); J. V. Hermans (imec); T. Tran (Lam Research); K. Viatkina (ASML); C.W. Liang, B.L. Ward, S. Chuang, J. Yu (Lam Research); J. Vandereyken (imec); D. Rio (ASM); M. Kubis (ASML); S. Tan, R.J. Wise (Lam Research); M.V. Dusa (ASML); S. Reddy, A. Singhal, B. van Schravendijk, G.A. Dixit, N. Shamma (Lam Research)
Extreme Ultraviolet (EUV) Lithography (Conference 10143)
Thursday, March 2, 8:30 AM

Complete schedules and registration information can be found on the SPIE Advanced Lithography website.

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