The continual scaling of device dimensions drives the need for ever smaller interconnects, the intricate wiring that links up to billions of individual components on a chip. As advanced devices require more interconnect levels, connecting everything becomes increasingly complex. Simply shrinking the tiny wires doesn’t work, as electrical performance degrades with smaller size and denser packing. To address these requirements, novel dielectric materials that boost insulating capacity and techniques that minimize resistance of the metal connections are being developed. These challenges will be the focus of the upcoming International Interconnect Technology Conference (IITC) and Advanced Metallization Conference (AMC) being held jointly on May 23-26 in San Jose, California.
As Silver sponsors of this event, we are delighted to play a role in bringing professionals together to discuss topics such as advanced interconnects, next-generation materials, contacts, process integration, and wafer-level packaging. In addition, Lam is sponsoring the Best Student Paper Award, which recognizes outstanding research performed by a graduate student.
Lam Research Supplier Seminar
On Tuesday, May 24, we will host an evening program with the theme, “Novel Materials and Integration Schemes for Sub-10 nm Interconnects” as part of the Supplier Seminar Series. The event will feature talks by industry experts, who will share their perspectives on emerging strategies. The presentations will be followed by a reception where attendees can continue the day’s discussions, chat with Lam technologists, and enjoy refreshments.
Lam Research Technical Presentations
You can also hear more about Lam’s activities and developments in the areas of metallization and advanced packaging at the following presentations:
Thermo-Mechanical Behavior of Copper TSV and the Effect of Alternative Metal Liners
J. Shin, M. Thorum, and J. Richardson
Wednesday, May 25, 4:15–5:45 PM poster session
Amorphous Co-Ti Alloy as a Single Layer Barrier for Co Local Interconnect Structure
M. Hosseini, J. Koike, and Y. Sutou (Tohoku University); L. Zhao, S. Lai, and R. Arghavani (Lam Research)
Wednesday, May 25, 4:15–5:45 PM poster session
Development of Electroless Co Via-Prefill to Enable Advanced BEOL Metallization and Via Resistance Reduction
Y. Jiang, P. Nalla, Y. Matsushita, G. Harm, J. Wang, A. Kolics, L. Zhao, T. Mountsier, P. Besser, and H.-J. Wu
Thursday, May 26, 2:50–4:35 PM session
Complete schedules and registration information can be found on the IITC/AMC website. We hope to connect with you at the conference!