The full spectrum of patterning topics will be discussed at the upcoming SPIE Advanced Lithography symposium. Held at the San Jose Convention Center on February 23-27, 2020, the event features seven technical conferences covering the full spectrum of topics of interest to the micro- and nanolithography community. These include state-of-the-art tools, advanced unit processes and process integration, and novel patterning approaches.
Lam is proud to once again be the sponsor of the Advanced Etch Technology for Nanopatterning conference, as well as the exhibition bag sponsor. If you are at the show, be sure to visit Coventor in booth #323.
You can hear about some of the latest advances in patterning solutions from Lam and our collaborators at the following presentations:
High-Z metal-based underlayer patterning for improving EUV stochastics
Anuja De Silva, Jennifer Church, Dominik Metzler, Luciana Meli, Nelson M. Felix, IBM Thomas J. Watson Research Ctr. (USA); Phil Friddle, Bhaskar Nagabhirava, Mike Goss, Siva Kanakasabapathy, Rich Wise, Lam Research Corp. (USA)
EUV Lithography
Tuesday, February 25, 11:30 AM
Fin bending in dimensional scaling
Liping Zhang, imec (Belgium); David Hellin, Lam Research Corp. (Belgium); Alfonso Sepúlveda Márquez, Efrain Altamirano-Sánchez, Frederic Lazzarino, Pierre Morin, Shouhua Wang, Toby Hopf, Karine Kenis, Christophe Lorant, Farid Sebaai, Dmitry Batuk, Basoene Briggs, Hans Mertens, Steven Demuynck, imec (Belgium)
Advances in Patterning Materials and Processes
Tuesday, February 25, 3:50 PM
How to improve overlay of largely deformed 3D NAND wafers?
Michael Kubis, Jing Jin, Steven E. Steen, ASML Netherlands B.V. (Netherlands); Fayaz Shaikh, Bart van Schravendijk, Lam Research Corp. (USA)
Advances in Patterning Materials and Processes
Tuesday, February 25, 4:10 PM
Direct observation of inhibitor and selective deposition on nanoscale patterned structure
Derek Nowak, Liz Brinkman, Molecular Vista, Inc. (USA); Paul Lemaire, Lam Research Corp. (USA); Sung Park, Molecular Vista, Inc. (USA)
Advances in Patterning Materials and Processes
Wednesday, February 26, 9:20 AM
A novel approach to high productivity EUV patterning
Rich S. Wise, Lam Research Corp. (United States)
EUV Patterning and Etch
Wednesday, February 26, 9:40 AM
Holistic litho, films and etch for EUV DRAM storage node pad
Cyrus E. Tabery, ASML US, Inc. (United States); Nader Shamma, Lam Research Corp. (United States); Nicola Kissoon, ASML (Netherlands); Mircea Dusa, Joost Bekaert, IMEC (Belgium); Rich S. Wise, Lam Research Corp. (United States); Patrick Jaenen, IMEC (Belgium)
Advanced Patterning Integration
Wednesday, February 26, 3:00 PM
Impact of EUV resist thickness on local critical dimension uniformities for <30 nm CD via patterning
Benjamin Vincent, Coventor, SARL (France); Mark John Maslow, ASML Netherlands B.V. (Netherlands); Joseph Ervin, Coventor, SARL (France); Joost Bekaert, imec (Belgium)
Wednesday, February 26, 5:30 PM poster session
(Invited) Full stack computational optimization through process emulation
David Fried, Lam Research Corp. (USA)
Design-Process-Technology Co-Optimization for Manufacturability
Thursday, February 27, 1:30 PM
Complete schedules and registration information can be found on the SPIE Advanced Lithography website.
