While Moore’s Law has slowed at the individual chip level, advanced packaging enables continued industry progress by facilitating 3D architectures and stacking of devices. Innovations in 3D NAND, FinFETs, CFETs, and DRAM now rely on advanced packaging as semiconductor manufacturers build taller, more complex chip structures.
As a result, advanced packaging has evolved from a secondary consideration in semiconductor manufacturing to a fundamental technology enabling AI compute. It allows GPUs and high bandwidth memory (HBM) to be placed in close proximity, which boosts speed, power efficiency, and throughput essential for large language models (LLMs) and AI workloads.
Watch this in-depth discussion between Bob O’Donnell, president and chief analyst at TECHnalysis Research, and Audrey Charles, Senior Vice President of Corporate Strategy and Advanced Packaging at Lam Research, on the critical role of advanced packaging in enabling AI performance and semiconductor innovation.
