Blog

With over 40 years in making semiconductor equipment, Lam Research has demonstrated leadership in etch and deposition that meet the precision and yield demands of advanced packaging, helping customers ramp new technologies with confidence.

Not every chip on a wafer behaves the same; even small variations can impact yield. The Lam Semiverse Solutions team explains how engineers use virtual fabrication to understand why these differences happen and how to fix them.

Lam’s Aether® dry‑resist technology plays a key role in enabling next-gen logic chips, including the latest 2 nm node

DRAM is volatile memory that has the advantages of simplicity and high density. Lam is continuously innovating for each DRAM inflection as data-intensive AI requires more and more data at higher speeds.

Manufacturing breakthroughs in advanced chip packaging—especially heterogeneous integration and 3D stacking—are critical to powering the future of AI.

Watch the video on the next wave of semiconductor innovation with advanced packaging solutions from Lam Research.

Self-aligned backside contact (SABC) architectures in advanced GAA transistors expand the process window, reducing defects and improving chip yield.

Molybdenum hybrid metallization is driving innovation in semiconductor materials for AI, 5G, and data centers. These advances boost performance, sustainability, and efficiency in chip manufacturing.

The article discusses the challenges and solutions for back-end-of-line (BEOL) patterning at the 3-nm semiconductor node, focusing on controlling critical process parameters to manage edge placement error (EPE) and critical dimension (CD) variability.

Students at a growing number of U.S. schools learn the “why” of advanced 3D processes SEMulator3D® helps students with immersive training on leading edge technologies.