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- |Aug 23, 2023|
BEOL module processing faces challenges as chipmakers move to the 3 nm node and beyond. A semi-damascene integration scheme with airgap structures may help reduce RC delay time.
- |Mar 14, 2022|
Introduction As we approach the 1.5nm node and beyond, new BEOL device integration challenges will be presented. These challenges include the need for smaller metal pitches, along with support for...