Blog

Lam Research and CEA-Leti have formed a multi-year partnership to accelerate the development of specialty technology devices critical for AI hardware. This collaboration focuses on advancing materials, processes, and manufacturable solutions to improve energy efficiency and performance in AI data centers.

Lam Research’s Aether dry resist technology eliminates pattern collapse and reduces defects, enabling precise, high‑aspect‑ratio features for next‑generation 3D DRAM and HBM.

With over 40 years in making semiconductor equipment, Lam Research has demonstrated leadership in etch and deposition that meet the precision and yield demands of advanced packaging, helping customers ramp new technologies with confidence.

Not every chip on a wafer behaves the same; even small variations can impact yield. The Lam Semiverse Solutions team explains how engineers use virtual fabrication to understand why these differences happen and how to fix them.

Lam’s Aether® dry‑resist technology plays a key role in enabling next-gen logic chips, including the latest 2 nm node