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Advanced patterning techniques are essential for manufacturing next-generation semiconductor chips with extremely small and precise features, enabling higher performance, greater functionality, and improved cost efficiency in logic, DRAM, and NAND devices.

Gowri explains the challenges faced by chipmakers as they turn to 3D structures for logic, memory, and storage to continue Moore’s Law.

Dextro™ revolutionizes fab maintenance with sub-micron precision and AI-driven capabilities

Tiny changes in critical dimension, gate height, and similar features of advanced logic devices, such as FinFET SRAM, can affect yield. Through virtual experiments using the SEMulator3D® platform, the Semiverse Solutions team discusses how material stress and mechanical deformation resulting from these changes can be managed to enhance device performance.

AI’s evolution could be thwarted by electrical resistance in 3D architectures. Molybdenum, a breakthrough material, reduces resistance, improves performance.