The Semi 101 series is a beginner’s guide to understanding microchips and the semiconductor industry – from components to processes to players and everything in between.
As AI workloads grow, logic devices must continue to scale to tinier dimensions despite rising complexity. In this Lam Research Semi 101 video, we explain how advances in logic scaling are enabling faster, more energy‑efficient chips for today’s AI era.
The evolution from planar transistors to FinFETs and now gate‑all‑around architectures allow more transistors to fit into smaller areas while improving performance and reducing leakage. But shrinking features also introduces major manufacturing challenges, from wiring congestion to atomic‑level precision.
Lam advanced etch and deposition technologies, along with EUV‑enabled patterning and emerging approaches like backside power delivery, help overcome these obstacles.
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