- Lam was recently honored with an Edison Award for its cryogenic etch technology
- Named after Thomas Edison, the prestigious prize highlights “true innovation in business”
Driving the news: Lam Research won the 2025 Edison Gold Award in the Innovation in Production Processes category for our Cryo™ 3.0 cryogenic etch technology.
Why it matters: The Edison Awards, which Lam Research also won in 2023 for its next-generation selective etch portfolio (Argos®, Prevos® and Selis®), honor products and services that represent "game-changing" excellence and leadership in innovation.
- Lam Cryo 3.0 was selected from hundreds of nominations, underscoring its significant impact and transformative potential in the artificial intelligence (AI) era.
Lam Cryo 3.0 helps conquer the biggest chip manufacturing challenges by:
- Enabling precise etching of 10-micron memory channels with <0.1% deviation1 of the channel’s critical dimension from the top to the bottom,
- Boosting etch speeds 2.5x over conventional methods, and
- Reducing energy usage by 40 percent2 and emissions by 90 percent.3
What we’re hearing: “We appreciate this award for recognizing the hard work and expertise of Lam engineers who developed Cryo 3.0," says Tae Won Kim, CVP of global products in the Etch Dielectric department. "It is wonderful to be among many other winners in this year's Edison Awards."
Dig Deeper into Lam Cryo 3.0
- What you need to know about Lam Cryo 3.0
- Watch Harmeet Singh, Lam GVP and GM of etch products, explain the role of Cryo 3.0 in 1,000-layer 3D NAND
- Read about Lam's Edison Award for Argos, Prevos, and Selis
1Profile deviation calculated by maximum critical dimension minus minimum critical dimension divided by memory channel depth.
2Estimated emissions reduction calculated using IPPC (Intergovernmental Panel on Climate Change) guidelines for greenhouse gas inventories. The estimated reduction has not been independently verified.
390 percent reduction in Kg CO2 per wafer is based on current recipe conditions and IPCC guidelines for Global Warming Potential (GWP).
Caution Regarding Forward-Looking Statements
Statements made in this article that are not of historical fact are forward-looking statements and are subject to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate to but are not limited to: market and industry trends; the potential benefits of and applications resulting from our technology and solutions; and the potential of our technologies and solutions to result in emissions reductions. Some factors that may affect these forward-looking statements include: trade regulations, export controls, trade disputes, and other geopolitical tensions may inhibit our ability to sell our products; business, political and/or regulatory conditions in the consumer electronics industry, the semiconductor industry and the overall economy may deteriorate or change; the actions of our customers and competitors may be inconsistent with our expectations; supply chain cost increases and other inflationary pressures have impacted and may continue to impact our profitability; supply chain disruptions or manufacturing capacity constraints may limit our ability to manufacture and sell our products; and natural and human-caused disasters, disease outbreaks, war, terrorism, political or governmental unrest or instability, or other events beyond our control may impact our operations in affected areas; as well as the other risks and uncertainties that are described in the documents filed or furnished by us with the Securities and Exchange Commission, including specifically the Risk Factors described in our annual report on Form 10-K for the fiscal year ended June 30, 2024 and our quarterly report on Form 10-Q for the quarter ended December 29, 2024. These uncertainties and changes could materially affect the forward-looking statements and cause actual results to vary from expectations in a material way. The Company undertakes no obligation to update the information or statements made in this article.