Blog

Not every chip on a wafer behaves the same; even small variations can impact yield. The Lam Semiverse Solutions team explains how engineers use virtual fabrication to understand why these differences happen and how to fix them.

Lam's Semiverse Solutions team explores the innovative approach of backside power delivery networks (BSPDNs) in semiconductor technology.

There are still many challenges to be overcome before CFET designs become mainstream, but this new 3D architecture represents a promising new direction for the future of computing.