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The industry’s transition to 3D NAND is being driven by several important advantages, including its ability to deliver higher capacity with a lower cost per bit. These vertical architectures...

The demands of our modern world for more connectivity, functionality, and capacity from our electronic devices – alongside the seemingly endless imagination for new applications – are pushing...

If you’re part of the semiconductor industry, you know there are few better networking and technical sharing venues than the SEMICON tradeshows, and SEMICON West is no exception. Being held in...

Used to extend the capabilities of conventional lithography, multiple patterning is a process of overlaying patterns of larger dimensions to achieve smaller and/or more tightly packed features. In...

Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition (ALD) is a reality. In fact, it’s being used in an...

Southeast Asia is a major hub for the chip industry’s assembly, packaging, and test services – back-end manufacturing processes that are becoming an increasingly important topic of discussion....

Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost of back-end processes for some...

In recent years, SEMICON China has become the semiconductor industry’s largest annual tradeshow, with much of its popularity likely due to the region’s growing chipmaking business. Attendees...

It really is remarkable how our favorite tech products continue to become more compact and powerful, with today’s nanoscale chipmaking quite literally pushing the limits of what is possible. One...

For its 30th anniversary, SEMICON Korea anticipates hosting its largest show ever, with an estimated 40,000 attendees converging at COEX in Seoul on February 8-10, 2017. Korea is the world’s...