Blog

Glass substrates offer mechanical, electrical, and chemical advantages for AI and HPC chips Industrywide adoption first requires resolving manufacturing and standardization issues Lam is helping...

Lam and imec are expanding joint R&D to accelerate manufacturing readiness.

AI is increasing demand for larger and more complex chip packages. Traditional wafer-based packaging faces scaling challenges for large-format designs. Panel-level processing may improve...

Lam's labs are part of a purpose-built, globally integrated R&D infrastructure designed to accelerate innovation across technology inflections.