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Lam’s leadership in 3D NAND built the playbook for memory’s complex architectural transition. Companies that learn from and apply their experience will lead the way to 3D DRAM.

AI is compressing chip development timelines and raising the stakes for equipment suppliers Here is how Lam is responding Speed has always mattered in the semiconductor industry. What is different...

The 2026 Lam Capital Venture Competition is a unique event that connects semiconductor startups with industry leaders, investors, and technical experts to advance AI-enabled semiconductor technologies.

Light-based interconnects dramatically improve AI computing speed, energy efficiency. Lam’s precision etch and dep tech make photonics manufacturable at scale.