Blog

There are still many challenges to be overcome before CFET designs become mainstream, but this new 3D architecture represents a promising new direction for the future of computing.

On the use and benefits of virtual fabrication in the development of DRAM saddle fin profiles

We explore the causes and implications of asymmetric wafer defects in semiconductor manufacturing. We also consider the use of virtual process modeling to understand and mitigate these structural failures.

The potential of Resistive Random Access Memory (ReRAM) as an alternative to SRAM for on-chip memory in advanced CPU applications.