Blog

Addressing critical needs for next-generation 3D NAND and DRAM devices, Lam has developed the industry’s first all-atomic layer deposition (ALD) low-fluorine tungsten (LFW) fill process with its...

Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of...

The semiconductor industry has long relied on the development of innovative device architectures and technologies to continue device scaling. Making these a reality in production, however,...

Dave Hemker, CTO at Lam Research, sat down with Semiconductor Engineering to look at some of the key issues on the process and manufacturing side, and some of the key developments that will...