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Manufacturing breakthroughs in advanced chip packaging—especially heterogeneous integration and 3D stacking—are critical to powering the future of AI.

Lam Research's new cobot, Dextro, can offload some of the most challenging and essential maintenance and cleaning tasks from human workers.

Sometimes the technology behind the scenes is just as impressive as the one that gets all the attention. So, it is with Generative AI. While most everyone seems to be falling over themselves...

Discover how Lam Research is achieving unprecedented storage capacities and speeds with their 1,000-layer 3D NAND chips.