Blog

Electrochemistry and solid-state science and technology will come together at the PRiME 2016 Meeting, held October 2-7 in Honolulu, Hawaii. One of the largest research conferences in the world,...

Chip designs are changing. Features are shrinking to incredibly small dimensions and radically new device architectures are being devised to supply consumers with smaller, more powerful...

What’s left after the relatively easy semiconductor manufacturing issues have been solved? The wicked hard problems – including things like scaling transistors down to 5 nm, reducing power...

Industry experts came together recently to discuss some of the critical challenges facing interconnect scaling. As the number of transistors on advanced chips continues to increase, fabricating...

The continual scaling of device dimensions drives the need for ever smaller interconnects, the intricate wiring that links up to billions of individual components on a chip. As advanced devices...

Is Moore’s Law still on track? Can transistors, already more than a thousand times smaller than a grain of sand, continue to get even smaller? This is the challenge faced by the advanced...

From materials research to plasma fundamentals, Lam’s technologists are contributing to practical and theoretical developments in their fields. One way they help advance technology and expand...