Blog

AI is increasing demand for larger and more complex chip packages. Traditional wafer-based packaging faces scaling challenges for large-format designs. Panel-level processing may improve...

Lam Research broke ground on a new advanced R&D lab in Tualatin, Oregon, expanding cleanroom capacity and strengthening its global lab network.

Lam Semiverse® Solutions engineers used SEMulator3D® stress modeling to show how channel thickness, fin width, and lateral etch can be optimized to reduce stress non-uniformity and improve gate-all-around nanosheet transistor performance.

Lam's labs are part of a purpose-built, globally integrated R&D infrastructure designed to accelerate innovation across technology inflections.