Blog

The article discusses the challenges and solutions for back-end-of-line (BEOL) patterning at the 3-nm semiconductor node, focusing on controlling critical process parameters to manage edge placement error (EPE) and critical dimension (CD) variability.

Cooperative robots take center stage at FIRST Global in Panama Lam is a pioneer in semi mechatronics, like Dextro

Students at a growing number of U.S. schools learn the “why” of advanced 3D processes SEMulator3D® helps students with immersive training on leading edge technologies.

At Lam we're pairing human ingenuity with advanced mechatronics and automation to solve big challenges for our customers. That same spirit will be on display at the 2025 FIRST Global Challenge.

Lam CVP David Fried explains how Fabtex Yield Optimizer is the newest Semiverse Solutions technology to help the semiconductor industry achieve higher yields