Blog

As we start to wind down 2017, all of us at Lam would like to take this opportunity to wish our friends, colleagues, customers, and collaborators around the globe a holiday season full of warmth...

Multiple patterning continues to be an important technique for enabling pitch shrinking in advanced chip designs. However, as the number of steps grows, managing process variation is a key...

The industry’s transition to 3D NAND is being driven by several important advantages, including its ability to deliver higher capacity with a lower cost per bit. These vertical architectures...

Used to extend the capabilities of conventional lithography, multiple patterning is a process of overlaying patterns of larger dimensions to achieve smaller and/or more tightly packed features. In...

Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost of back-end processes for some...