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- |Dec 13, 2018|
Wishing you every happiness this holiday season and throughout the coming year. We appreciate your readership and look forward to connecting with you again when our blog returns in January 2019.
- |Sep 4, 2018|
Atomic layer etching (ALE) is one of the chipmaking processes that makes our data-driven world possible. After being confined to the laboratory for decades, ALE has awakened to become the most...
- |Jul 16, 2018|
Now that our time at SEMICON West 2018 is over, we’d like to reflect on some of the sound-bites overheard last week. As always, the three-day conference and expo gave us insights into today’s...
- |Mar 7, 2018|
Lam Research has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award. The PQS award recognizes companies like Lam that Intel believes have relentlessly pursued...
- |Feb 26, 2018|
Looking ahead into the new year in technology often proves quite interesting and educational. For 2018, one well-established market – automotive – is gaining the attention of many technology...
- |Jan 2, 2018|
Welcome back to the Lam Blog. We hope you had a happy and prosperous holiday season. As a prelude to what you can expect in upcoming blog stories, we wanted to highlight some of the favorite posts...
- |Dec 14, 2017|
As we start to wind down 2017, all of us at Lam would like to take this opportunity to wish our friends, colleagues, customers, and collaborators around the globe a holiday season full of warmth...
- |Sep 11, 2017|
Multiple patterning continues to be an important technique for enabling pitch shrinking in advanced chip designs. However, as the number of steps grows, managing process variation is a key...
- |Jul 31, 2017|
The industry’s transition to 3D NAND is being driven by several important advantages, including its ability to deliver higher capacity with a lower cost per bit. These vertical architectures...
- |Jun 12, 2017|
Used to extend the capabilities of conventional lithography, multiple patterning is a process of overlaying patterns of larger dimensions to achieve smaller and/or more tightly packed features. In...