The Semi 101 series is a beginner’s guide to understanding microchips and the semiconductor industry – from components to processes and everything in between. This guide is updated regularly with new content, so bookmark the page and check back often.
- You may also be interested in our glossary of semiconductor industry terms.
What Is Silicon and How Is It Used for Chips?
Due to silicon’s abundance, ease of production, and electricity conducting capabilities, it is the most basic element in the production of semiconductors. Dive deeper to learn how silicon is used in microchips that power everything from toasters to autonomous vehicles.
What Is a Microchip Anyway?
What are chips made of? What are the different kinds of microchips? How are they made? Here are the basics.
What's the Difference Between Fabs, Fabless Companies, and Foundries?
The terms “fab” and “foundry” are often used interchangeably, but that’s technically incorrect. Knowing the difference is important for understanding how Lam caters to different semiconductor companies. Get the facts.
Etch Essentials
Read about the basics of etching, the different types of tools, and common mechanisms used in the etching process. Learn about Lam's role in providing etch technology to solve complex AI challenges.
Deposition Essentials
Read about the basics of deposition, the most common methods and techniques used for deposition processes, and the tools Lam provides that aid in the creation of innovative technologies.
Memory, Foundry, and Logic Markets Explained
Lam's customers are key players in three major categories for integrated circuit manufacturers. Read more about what these market segments involve and Lam's role in supporting our customers in these areas.
What Is Advanced Packaging?
Advanced packaging is a cutting-edge semiconductor technology that integrates multiple chips into a single package, enabling smaller, faster, and more energy-efficient microchips essential for applications like artificial intelligence (AI).
High-Bandwidth Memory Explained
High-bandwidth memory (HBM) is a transformative memory technology crucial for powering AI and next-generation computing by providing significantly faster data access and energy efficiency.
How Advanced Patterning Enables Smarter, Smaller Chips
Discover how advanced patterning techniques are revolutionizing the next generation of semiconductor devices. Learn about the cutting-edge tools and methods that enable the creation of smaller, more powerful chips that define our industry’s future. From single patterning to the latest in EUV lithography, we dive deep into the technology that's shaping the future of logic, DRAM, and NAND devices.
Gate-All-Around, Transistor Architecture Designed for the Future of Logic Devices (video)
In this video we explore the evolution of transistor architectures that have enabled logic scaling. From the basics of Field-Effect Transistors (FETs) to the advanced FinFET and Gate-All-Around designs, we delve into how these innovations have helped pack more transistors into smaller spaces while reducing electrical leakage. We also look ahead to the future with the introduction of CFET, which promises continued area scaling by vertically stacking transistors. Join us to understand the critical role of these technologies in the semiconductor industry and what lies ahead.
What Are Digital Twins and How Does Lam Use Them?
Learn how Lam customers use our Semiverse™ Soulutions software for the virtualization of physical assets and processes to save time, money, and resources.
Transitioning From Tungsten to Molybdenum
For nearly a quarter of a century, the semiconductor industry has relied on tungsten as the interconnect material of choice for advanced memory and logic applications. But as traditional metallization approaches reach their physical limits to meet evolving scaling demands for the AI era, the industry is turning to a new material–molybdenum (Mo).