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Light-based interconnects dramatically improve AI computing speed, energy efficiency. Lam’s precision etch and dep tech make photonics manufacturable at scale.

SEMulator3D® Analytics is useful in calibrating FinFET device profiles, helping engineers achieve high precision in modeling fin etch depth and critical dimensions.

With AI's overwhelming demand for DRAM, Lam is accelerating its response with streamlined workflows and specialized tools help speed efficiency, yield, and cost savings.

DRAM scaling has reached the angstrom level—and the advanced architectures and processes that make higher performance and lower cost per bit possible. Watch now to see how memory keeps getting smaller.

Lam Research and CEA-Leti have formed a multi-year partnership to accelerate the development of specialty technology devices critical for AI hardware. This collaboration focuses on advancing materials, processes, and manufacturable solutions to improve energy efficiency and performance in AI data centers.