Su | Mo | Tu | We | Th | Fr | Sa |
---|---|---|---|---|---|---|
Su | Mo | Tu | We | Th | Fr | Sa |
---|---|---|---|---|---|---|
- |Dec 12, 2023|
The potential of Resistive Random Access Memory (ReRAM) as an alternative to SRAM for on-chip memory in advanced CPU applications.
- |Nov 20, 2023|
Virtual process development tools can accelerate the identification of process hotspots. These techniques lead to cost savings and improved yields in chip manufacturing.
- |Nov 8, 2023|
Summary: The rise of Artificial Intelligence (AI) has placed significant demands on semiconductor performance, particularly in the realm of etching technology. AI requires massive amounts of data...
- |Oct 25, 2023|
Enables more efficient process development via high-fidelity plasma simulation
- |Oct 19, 2023|
The semiconductor industry is searching for alternative metal line materials to replace copper due to the increasing barrier size and resistivity issues. Ruthenium (Ru) has shown promise as a potential replacement, outperforming copper and cobalt (Co) at smaller dimensions.
- |Sep 26, 2023|
Virtual fabrication is a powerful tool to perform sensitivity analysis and provide guidance for inline process spec control
- |Sep 14, 2023|
Lam Research has supported the National GEM Consortium and GEM interns since 2019. Students who complete their fellowship have a chance to join Lam full-time.
- |Aug 31, 2023|
Video games and virtual and augmented reality are driving demand for haptics. Lam’s pulsed laser deposition capability can enable next-gen haptics technology.
- |Aug 23, 2023|
BEOL module processing faces challenges as chipmakers move to the 3 nm node and beyond. A semi-damascene integration scheme with airgap structures may help reduce RC delay time.
- |Aug 9, 2023|
Lam Research and the Centre for Nano Science and Engineering (CeNSE) at the Indian Institute of Science (IISc) partner to train up to 60,000 semiconductor engineers.