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As AI accelerates demand for advanced chips, sustainability is becoming essential for long-term growth

Pattern-dependent etch can lead to variations across the same chip. Dummy fill and SEMulator3D® help reduce shallow trench isolation and recess nonuniformity.

In DRAM SAQP, small process variations can compound into pitch walk and, with LER, create line-bridge defects. Monte Carlo virtual fabrication reveals these interactions to tighten process windows and reduce wafer experimentation.

Lam solutions for large 300-mm wafers aid in MEMS evolution. MEMS sensors are crucial in AI-powered devices and IoT. applications.