Blog

Lam Research’s new Silicon Valley warehouse speeds semiconductor parts retrieval and strengthens U.S. supply chain resilience.

AI is increasing demand for larger and more complex chip packages. Traditional wafer-based packaging faces scaling challenges for large-format designs. Panel-level processing may improve...

Lam Research broke ground on a new advanced R&D lab in Tualatin, Oregon, expanding cleanroom capacity and strengthening its global lab network.

SABRE 3D is an electrochemical deposition solution engineered for precision copper plating (the critical wiring of modern semiconductor devices).

AI is redefining semiconductor scaling Audrey Charles discusses the technologies, partnerships, and innovations that will define the future of semiconductor scaling AI is driving unprecedented...

A Lam scanning electron microscope technician shares how he started a career at Lam Research and continues his journey today as a lab supervisor.

See how Lam’s dry resist technology helps enable the precision, flexibility, and efficiency needed for next-generation EUV chipmaking.

Driving the news: Lam Research moved up the Fortune 500, reflecting strong revenue in Lam’s most recent fiscal year as demand for advanced semiconductor accelerates in the AI era. Lam ranked 238...

The 2026 Lam Capital Venture Competition highlighted breakthrough semiconductor innovations with Lightfinder winning for its chip-scale optical sensing technology designed to enable real-time, in-tool metrology. This event showcased Lam Research's leadership in supporting startups that build the AI backbone for semiconductor manufacturing.

As semiconductor manufacturing grows more complex, sensor‑driven intelligence is emerging as a critical enabler of autonomous, data‑driven fabs.