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- |Mar 9, 2017|
Lam Research has been recognized by Intel as a 2016 Preferred Quality Supplier (PQS) award winner. The PQS award celebrates exceptional, persistent performance and the continuous pursuit of...
- |Jan 25, 2017|
Along with many of our friends and colleagues around the world, we look forward to the start of the new lunar year and anticipate the opportunities and experiences it may bring. For 2017, the...
- |Jan 17, 2017|
Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. The external chip structure...
- |Jan 3, 2017|
Happy New Year and welcome back to the Lam Blog! For our first article of 2017, we wanted to share a few of our most popular stories from last year. These made our short list for their blend of...
- |Dec 15, 2016|
As 2016 comes to a close, we thought we’d take a few moments to look back on the year as reflected in the Lam Blog. Through our stories, we shared some of our proud moments, like when the...
- |Sep 6, 2016|
With the introduction of Lam’s latest Flex™ dielectric etch system, we have expanded our atomic layer etching (ALE) portfolio to include both conductor and dielectric etch. At the 10 nm...
- |Aug 9, 2016|
Addressing critical needs for next-generation 3D NAND and DRAM devices, Lam has developed the industry’s first all-atomic layer deposition (ALD) low-fluorine tungsten (LFW) fill process with its...
- |Aug 1, 2016|
Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of...
- |Jul 17, 2016|
The semiconductor industry has long relied on the development of innovative device architectures and technologies to continue device scaling. Making these a reality in production, however,...
- |May 23, 2016|
Dave Hemker, CTO at Lam Research, sat down with Semiconductor Engineering to look at some of the key issues on the process and manufacturing side, and some of the key developments that will...