Blog

Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. The external chip structure...

Happy New Year and welcome back to the Lam Blog! For our first article of 2017, we wanted to share a few of our most popular stories from last year. These made our short list for their blend of...

As 2016 comes to a close, we thought we’d take a few moments to look back on the year as reflected in the Lam Blog. Through our stories, we shared some of our proud moments, like when the...

With the introduction of Lam’s latest Flex™ dielectric etch system, we have expanded our atomic layer etching (ALE) portfolio to include both conductor and dielectric etch. At the 10 nm...

Addressing critical needs for next-generation 3D NAND and DRAM devices, Lam has developed the industry’s first all-atomic layer deposition (ALD) low-fluorine tungsten (LFW) fill process with its...

Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of...

The semiconductor industry has long relied on the development of innovative device architectures and technologies to continue device scaling. Making these a reality in production, however,...

Dave Hemker, CTO at Lam Research, sat down with Semiconductor Engineering to look at some of the key issues on the process and manufacturing side, and some of the key developments that will...

For centuries, celebrating the beginning of the lunar new year has been one of the most treasured annual holidays in many parts of Asia. The new year is a time of reflection and thankfulness for...

With the new year underway, you may be wondering what lies ahead for the semiconductor world. Once again, Solid State Technology has checked in with industry leaders for their thoughts on the...