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Lam engineers worked with a customer to develop a short-term solution that has the potential to reduce the use of high GWP gases like NF3 that is also relatively easy to implement and doesn’t jeopardize the quality of the production.

DWMG structures can help improve DRAM by reducing energy waste. These structures fix a known flaw called “gate-induced drain leakage” (GIDL).

Lam’s latest etch tool, called Akara®, is a significant achievement that helps enable the future of semiconductors requiring small, complex structures. Akara uses proprietary plasma processing technologies to deliver a high degree of etch process control and responsiveness that goes beyond the capabilities of mainstream plasma etch technologies.

Lam has developed the world's only EUV dry resist deposition and dry development technologies with capabilities that support leading-edge pattern fidelity, defectivity, material usage, and overall cost of ownership.

To evaluate stress and mitigate its effects, predictive 3D process models can be used to predict the impact of mechanical stress on yield and performance.

Virtual twin technologies can reduce the carbon footprint of the tool R&D process.

Lam’s university collaborations supports Lam’s technology pipeline and talent pipeline with creative approaches to industry challenges.

AR and VR are helping the company shift left and ramp for the $1 trillion industry Lam’s adoption of immersive technologies is expected to beat today’s KPIs by 20% Driving the news: With the...

Learn about three key semiconductor markets and Lam’s role in supporting our customers Find out what innovative technology is driving each market and Lam’s tools that help enable it Lam...

Nearly all microchips begin as slices of highly purified silicon.