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As semiconductor manufacturing grows more complex, sensor‑driven intelligence is emerging as a critical enabler of autonomous, data‑driven fabs.

Lam Research won two prestigious 2026 Edison Awards, for ALTUS® Halo and Akara®

Pattern-dependent etch can lead to variations across the same chip. Dummy fill and SEMulator3D® help reduce shallow trench isolation and recess nonuniformity.

In semiconductor manufacturing, precision is everything. As chips become more advanced and fabs operate under unprecedented pressure to meet AI-driven demand, even the smallest maintenance error...

Everything—NAND, Logic, DRAM, and packaging—is going 3D. The 3D era demands deeper etch and precise deposition to build taller, tighter devices.