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Lam Research collaborates with universities and academic research consortia by supporting research, building relationships, and assisting graduate and undergraduate students with thesis awards,...

The latest developments in patterning will be on stage at the upcoming SPIE Advanced Lithography, held as a digital forum February 22-26. Patterning – the set of steps that transfers chip...

With more than a decade of industry leadership in high aspect ratio etching, Lam now introduces Vantex™, the latest in dielectric etch technology. Designed from the ground up specifically for...

To kick-off the new year, SEMICON Korea is bringing together industry leaders throughout the semiconductor supply chain. Held February 3-12, participants can learn more about artificial...

To kick-off the new year, we thought we’d share some of our favorite stories from 2020. While not exhaustive, this short list features articles that help put technology concepts into perspective...

Filling complex, high aspect ratio structures is a challenge for 3D NAND, DRAM, and logic chipmakers. Lam’s Aaron Fellis, vice president and general manager of dielectric atomic layer deposition...

When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in the “brains” of a chip. As compared to...

Semiconductor process development is no easy task, with each generation of devices more difficult and expensive to create. Traditional cycles of build-and-test development are becoming obsolete,...

Lam’s newest product in its line of GAMMA® dry photoresist strip systems, brings the performance of the GAMMA® GxT® 300 mm to 200 mm wafer processing. The GAMMA GxT has been specifically...

In today’s press release below, Lam announced the new Striker® FE platform featuring its patented ICEFill™ technology, which provides bottom-up filling in complex high aspect ratio (HAR)...