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“Data is giving rise to a new economy” – The Economist (2017). This compelling reality makes the continued development of high-capacity data storage technologies like 3D NAND ever more...

Chipmakers want every part of the wafer to produce, or yield, good die. Advances in process technologies over the years have just about made this a reality, even as feature dimensions continue to...

The industry’s transition to 3D NAND is being driven by several important advantages, including its ability to deliver higher capacity with a lower cost per bit. These vertical architectures...

The demands of our modern world for more connectivity, functionality, and capacity from our electronic devices – alongside the seemingly endless imagination for new applications – are pushing...

If you’re part of the semiconductor industry, you know there are few better networking and technical sharing venues than the SEMICON tradeshows, and SEMICON West is no exception. Being held in...

Used to extend the capabilities of conventional lithography, multiple patterning is a process of overlaying patterns of larger dimensions to achieve smaller and/or more tightly packed features. In...

Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition (ALD) is a reality. In fact, it’s being used in an...

Southeast Asia is a major hub for the chip industry’s assembly, packaging, and test services – back-end manufacturing processes that are becoming an increasingly important topic of discussion....

Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost of back-end processes for some...

In recent years, SEMICON China has become the semiconductor industry’s largest annual tradeshow, with much of its popularity likely due to the region’s growing chipmaking business. Attendees...