Blog

We take microprocessors for granted. Most people who aren’t deeply involved in technology may have no idea all of the places where a microprocessor shows up in their lives. It’s not just their...

Engineers, scientists, and industry professionals will attend the 239th Electrochemistry Society (ECS) Meeting and the 18th International Meeting on Chemical Sensors (IMCS), held May 30 to June 3....

Silicon chip manufacturing has always included etching as a critical processing step. But, increasingly, extremely high-aspect-ratio etching has been needed for 3D flash and DRAM chips, which have...

As chipmakers move to advanced technology nodes, they are challenged to resolve ever finer features. One of the major roadblocks involves the material used to transfer chip design to the wafer;...

Lam Research collaborates with universities and academic research consortia by supporting research, building relationships, and assisting graduate and undergraduate students with thesis awards,...

The latest developments in patterning will be on stage at the upcoming SPIE Advanced Lithography, held as a digital forum February 22-26. Patterning – the set of steps that transfers chip...

With more than a decade of industry leadership in high aspect ratio etching, Lam now introduces Vantex™, the latest in dielectric etch technology. Designed from the ground up specifically for...

To kick-off the new year, SEMICON Korea is bringing together industry leaders throughout the semiconductor supply chain. Held February 3-12, participants can learn more about artificial...

To kick-off the new year, we thought we’d share some of our favorite stories from 2020. While not exhaustive, this short list features articles that help put technology concepts into perspective...

Filling complex, high aspect ratio structures is a challenge for 3D NAND, DRAM, and logic chipmakers. Lam’s Aaron Fellis, vice president and general manager of dielectric atomic layer deposition...