Blog

The 2026 Lam Capital Venture Competition is a unique event that connects semiconductor startups with industry leaders, investors, and technical experts to advance AI-enabled semiconductor technologies.

Light-based interconnects dramatically improve AI computing speed, energy efficiency. Lam’s precision etch and dep tech make photonics manufacturable at scale.

SEMulator3D® Analytics is useful in calibrating FinFET device profiles, helping engineers achieve high precision in modeling fin etch depth and critical dimensions.

DRAM scaling has reached the angstrom level—and the advanced architectures and processes that make higher performance and lower cost per bit possible. Watch now to see how memory keeps getting smaller.

Lam Research’s Aether dry resist technology eliminates pattern collapse and reduces defects, enabling precise, high‑aspect‑ratio features for next‑generation 3D DRAM and HBM.

With over 40 years in making semiconductor equipment, Lam Research has demonstrated leadership in etch and deposition that meet the precision and yield demands of advanced packaging, helping customers ramp new technologies with confidence.

Lam Research is setting the agenda for the wafer fabrication equipment industry's approach to a silicon photonics revolution

DRAM is volatile memory that has the advantages of simplicity and high density. Lam is continuously innovating for each DRAM inflection as data-intensive AI requires more and more data at higher speeds.

Lam’s newest innovation, the VECTOR® TEOS 3D tool, is crafted at its Tualatin, Oregon facility by a talented local workforce known for its multidisciplinary expertise. The company’s strong commitment to employee safety, career satisfaction, and professional growth has resulted in an outstanding retention rate, making Tualatin a standout example of manufacturing excellence.

Manufacturing breakthroughs in advanced chip packaging—especially heterogeneous integration and 3D stacking—are critical to powering the future of AI.