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|May 7, 2026|As semiconductor manufacturing grows more complex, sensor‑driven intelligence is emerging as a critical enabler of autonomous, data‑driven fabs.
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|Apr 27, 2026|Lam Research won two prestigious 2026 Edison Awards, for ALTUS® Halo and Akara®
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|Apr 8, 2026|In this edition of Semi 101, we explore the evolution of transistor architectures that have enabled logic scaling.
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|Mar 19, 2026|Integrity isn’t optional at Lam, and this latest recognition underscores that commitment.
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|Mar 17, 2026|IBM and Lam Research have partnered in a five-year collaboration to develop processes that enable logic chip scaling beyond the 1nm node using high-NA EUV lithography.
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|Mar 10, 2026|The 2026 Lam Capital Venture Competition is a unique event that connects semiconductor startups with industry leaders, investors, and technical experts to advance AI-enabled semiconductor technologies.
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|Feb 24, 2026|With AI's overwhelming demand for DRAM, Lam is accelerating its response with streamlined workflows and specialized tools help speed efficiency, yield, and cost savings.
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|Feb 19, 2026|As a viable alternative to silicon, gallium nitride (GaN) can help data centers meet the growing demands of AI by enabling more efficient power delivery and reducing energy consumption.
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|Feb 13, 2026|DRAM scaling has reached the angstrom level—and the advanced architectures and processes that make higher performance and lower cost per bit possible. Watch now to see how memory keeps getting smaller.
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|Feb 12, 2026|Lam Research and CEA-Leti have formed a multi-year partnership to accelerate the development of specialty technology devices critical for AI hardware. This collaboration focuses on advancing materials, processes, and manufacturable solutions to improve energy efficiency and performance in AI data centers.
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|Feb 11, 2026|Lam Research’s Aether dry resist technology eliminates pattern collapse and reduces defects, enabling precise, high‑aspect‑ratio features for next‑generation 3D DRAM and HBM.
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|Feb 5, 2026|With over 40 years in making semiconductor equipment, Lam Research has demonstrated leadership in etch and deposition that meet the precision and yield demands of advanced packaging, helping customers ramp new technologies with confidence.
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|Jan 23, 2026|Lam’s Aether® dry‑resist technology plays a key role in enabling next-gen logic chips, including the latest 2 nm node
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|Jan 23, 2026|Fortune has named Lam to its World’s Most Admired Companies list for 2026.
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|Jan 12, 2026|DRAM is volatile memory that has the advantages of simplicity and high density. Lam is continuously innovating for each DRAM inflection as data-intensive AI requires more and more data at higher speeds.
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|Jan 8, 2026|Lam Research improved its CDP Climate Change score from B to A-, reflecting progress toward our net zero goal and commitment to transparency.
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|Jan 7, 2026|Lam’s newest innovation, the VECTOR® TEOS 3D tool, is crafted at its Tualatin, Oregon facility by a talented local workforce known for its multidisciplinary expertise. The company’s strong commitment to employee safety, career satisfaction, and professional growth has resulted in an outstanding retention rate, making Tualatin a standout example of manufacturing excellence.
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|Dec 9, 2025|Watch the video on the next wave of semiconductor innovation with advanced packaging solutions from Lam Research.
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|Dec 8, 2025|Micron awarded Lam for exceptional performance in front-end equipment supply.
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|Nov 21, 2025|Lam Research’s latest milestone in its global expansion is in Tualatin, Oregon. The development signals what’s next for Oregon, the Silicon Forest, and the future of American leadership in the semiconductor industry.
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|Nov 17, 2025|Startup backed by Lam Capital reduces metal contaminated liquid waste by up to 90%
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|Nov 5, 2025|Molybdenum hybrid metallization is driving innovation in semiconductor materials for AI, 5G, and data centers. These advances boost performance, sustainability, and efficiency in chip manufacturing.
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|Nov 3, 2025|As a founding donor of the Semiconductor Pathways Fund, Lam Research is taking action to ensure promising STEM students can complete their degrees and power the next generation...
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|Oct 30, 2025|As Moore’s Law slows, advanced semiconductor packaging techniques are being adopted to integrate multiple chip types like logic, memory, and I/O into a single package, enhancing performance and cost-efficiency.
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|Oct 29, 2025|Cooperative robots take center stage at FIRST Global in Panama Lam is a pioneer in semi mechatronics, like Dextro
