Blog

Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of...

Chip designs are changing. Features are shrinking to incredibly small dimensions and radically new device architectures are being devised to supply consumers with smaller, more powerful...

The semiconductor industry has long relied on the development of innovative device architectures and technologies to continue device scaling. Making these a reality in production, however,...

The semiconductor industry uses so many unique terms, it practically has its own language. To keep up on the latest developments, knowing that “language” can be really helpful. For instance,...

What’s left after the relatively easy semiconductor manufacturing issues have been solved? The wicked hard problems – including things like scaling transistors down to 5 nm, reducing power...

Industry experts came together recently to discuss some of the critical challenges facing interconnect scaling. As the number of transistors on advanced chips continues to increase, fabricating...

Dave Hemker, CTO at Lam Research, sat down with Semiconductor Engineering to look at some of the key issues on the process and manufacturing side, and some of the key developments that will...

The continual scaling of device dimensions drives the need for ever smaller interconnects, the intricate wiring that links up to billions of individual components on a chip. As advanced devices...

Building on its inaugural success last year, this year’s SEMICON Southeast Asia 2016 takes place April 26-28 at the SPICE Arena in Penang, Malaysia. Lam is pleased to be a premier sponsor of...

Since its introduction in the 1980s, NAND flash memory has radically changed how we store our digital data. Remember ordering duplicate photos when getting camera film developed or burning your...